Industry Directory: action circuits (9)

Action Controls, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Action Controls, Inc. is a (Seattle area) based contract electronic manufacturer (CEM) that has been delivering high quality electronic manufacturing services (EMS), since 1991 to customers across both domestic and global markets.

XJTAG

Industry Directory | Consultant / Service Provider

XJTAG provides a full range of JTAG products to help you debug board designs with BGAs, test hardware that includes FPGAs, CPLDs, DSPs or microprocessors.

New SMT Equipment: action circuits (625)

PCB Mini Loader For SMT | SZTech-SMT

PCB Mini Loader For SMT | SZTech-SMT

New Equipment | Board Handling - Conveyors

PCB Mini Loader For SMT, an easy PCB loader solution for SMT. The operator does not need to insert the board very carefully, the loader will arrange it perfectly! No air controller is needed, the board will be sent by the motor of the conveyor. Th

SZTech-SMT Firm

HMH-830 PCBA coating machine PCBA coating system

HMH-830 PCBA coating machine PCBA coating system

New Equipment | Coating Equipment

HMH-830 PCBA coating machine PCBA coating system X, Y, Z, three-axis motion, accurately realize the selective spraying process of various circuit boads to avoid non-coated areas such as connectors. 1.Accurately realize selective spraying of various

Qinyi Electronics Co.,Ltd

Electronics Forum: action circuits (39)

Silly Attrition Levels

Electronics Forum | Fri Nov 07 06:06:27 EST 2003 | loz

Tape and reeling services as follows:- Specific Components Ltd. Tel. 01257 279944 Others available are Action Circuits, in Luton. Intosert in Northampton. Sorry no contact details for above. Loz

How many repairs for SMT component ?

Electronics Forum | Tue Aug 17 15:58:14 EDT 2010 | rob_thomas

IPC-7711/7721 states under Scope section: "This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly". This is from Rev B of this standard. There are many factors that play a role in the d

Used SMT Equipment: action circuits (14)

Fluke 810

Fluke 810

Used SMT Equipment | In-Circuit Testers

Fluke 810 Vibration Tester The Fluke 810 Vibration Tester is the most advanced troubleshooting tool for mechanical maintenance teams who need an answer now. The unique diagnostic technology helps you quickly identify and prioritize mechanical p

Test Equipment Connection

Fluke Fluke 810

Fluke Fluke 810

Used SMT Equipment | In-Circuit Testers

Fluke 810 Vibration Tester The Fluke 810 Vibration Tester is the most advanced troubleshooting tool for mechanical maintenance teams who need an answer now. The unique diagnostic technology helps you quickly identify and prioritize mechanical p

Test Equipment Connection

Industry News: action circuits (195)

Boundless Files for Chapter 11 Protection

Industry News | 2003-03-14 08:54:29.0

The action is part of its continuing efforts to serve its many loyal customers, the company said.

SMTnet

MC Industry Sdn Bhd to Invest Add'l US$4M in PCB Production in China

Industry News | 2003-02-14 08:28:51.0

Will Increase Its Equity Investment in Its Wholly-owned Unit in China, Grand Circuit Industry (Suzhou) Co.

SMTnet

Technical Library: action circuits (2)

MOISTURE PHYSICS AND PROCESS OF DRYING OF PRINTED CIRCUIT BOARDS

Technical Library | 2024-01-08 21:31:01.0

The aim of this collection and interpretation is to develop an understanding of moisture in materials, especially in printed circuit boards, to know the effects on further processing and to be able to derive targeted corrective actions when moisture-related problems occur. In principle, the considerations are valid for all types of PCBs. Although these basic principles are of particular importance when working with flexible and rigid-flexible printed circuit boards; observing them can mean the difference between success or failure.

Würth Elektronik GmbH & Co. KG

Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs

Technical Library | 2020-08-27 01:22:45.0

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.

Teledyne DALSA

Videos: action circuits (5)

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

JOT board handling in action.

JOT board handling in action.

Videos

Successful manufacturing requires that the materials are in the right place Just on Time. Our board handling products are known for high quality, even our first PCB handling products from early 90’s are still used in many factories around the world.

JOT Automation, Inc.

Events Calendar: action circuits (1)

Wine Down Wednesday: Driving Innovation through Intrapreneurship

Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,

Wine Down Wednesday: Driving Innovation through Intrapreneurship

Surface Mount Technology Association (SMTA)

Career Center - Jobs: action circuits (41)

Field Service Engineer

Career Center | Florham Park, New Jersey USA | Engineering

Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S

Heller Industries Inc.

Quality Engineer

Career Center | Meridian, Idaho USA | Quality Control

Actively participate in continuous improvement activities at the product, process, and Quality System level. Identify unique customer quality requirements then develop, maintain, and improve the tools to support these requirements for printed cir

Western Electronics

Career Center - Resumes: action circuits (35)

Process Engineering/Maintenance Technician

Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control

• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat

Sales

Career Center | Chennai, India | Sales/Marketing

Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali

Express Newsletter: action circuits (721)

Partner Websites: action circuits (79)


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convection smt reflow ovens

High Throughput Reflow Oven
Selective soldering solutions with Jade soldering machine

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